The same basic process used for powdered metals and ceramics can be slightly modified by the addition of temperature (typically up to 90°C) for the lamination of components for the electronics industry. Pressure ranges for lamination have typically been in the 5,000 to 10,000 PSI (344 to 688 Bar) range. Recent developments in the industry have indicated that future pressure ranges could be in the 30,000 to 60,000 PSI (2068 to 4136 Bar) range. Quintus is in the process of providing presses for the future need now.
Quintus has developed a series of high pressure Isostatic Laminating Presses (ILP) for the cost-effective lamination of a variety of electronic components including MLCC’s, LTCC’s, hybrid chips, ferrites, Base Metal Element packages, multi-layer PZTs, medical electronics and implant devices, electronic filters, Varistors, Bluetooth components, fuel cells, and other multi-layer modules..